Meet INSLOGIC at Formnext 2026: Shaping the Future of Additive Manufacturing
Press

Meet INSLOGIC at Formnext 2026: Shaping the Future of Additive Manufacturing

INSLOGIC is heading to Formnext 2026! Join us in Frankfurt, Germany, from November 17–20 at Booth 120-C11 to explore our advanced engineering materials, the FilaDC i10 active dehumidifying cabinet,...
INSLOGIC and Neural4D Team Up to Turn AI Designs into 3D Prints
Press

INSLOGIC and Neural4D Team Up to Turn AI Designs into 3D Prints

INSLOGIC and Neural4D partner to turn AI-generated 3D designs into physical prints, combining AI-powered design tools with reliable 3D printing filaments.
Inslogic Lab Notes Vol. 5: Mastering PP 3D Printing & Fixing Warps
Filament Guide

Inslogic Lab Notes Vol. 5: Mastering PP 3D Printing & Fixing Warps

Polypropylene (PP) is a lightweight engineering powerhouse with incredible chemical resistance and toughness. However, it is also notorious for severe warping. In Vol. 5 of our Lab Notes, we explor...
The Evolution of Filament Storage: Why Active Dehumidification Matters
Guide

The Evolution of Filament Storage: Why Active Dehumidification Matters

Moisture is the invisible enemy of 3D printing. After years of relying on heat to dry filament, it's time to rethink how we store it. Watch our latest tests and discover why active dehumidification...
End the Re-Drying Cycle: A Better Way to Store Filament with the i10
Filament Guide

End the Re-Drying Cycle: A Better Way to Store Filament with the i10

Managing multiple open filament spools shouldn't mean endless individual container checks or silica gel replacements. The Inslogic × SUNLU FilaDC i10 active dehumidifying cabinet streamlines your s...
Global Highlights: Recapping Inslogic at EXPO3DBR & Formnext Asia Shenzhen
Press

Global Highlights: Recapping Inslogic at EXPO3DBR & Formnext Asia Shenzhen

August saw Inslogic expand its global reach with dynamic showcases in Brazil and Shenzhen, featuring an exclusive early look at the Inslogic × SUNLU i10 Dehumidifier. Check out our August highlight...
Inslogic PC Filament: Extreme Heat Resistance Meets Optical Clarity
Filament Guide

Inslogic PC Filament: Extreme Heat Resistance Meets Optical Clarity

When standard filaments melt or shatter under pressure, engineers turn to Polycarbonate (PC). Watch our real-world stress tests and dive into the raw technical data to see why Inslogic PC is the ul...
Meet Inslogic Across the Globe: August–September Exhibitions & Exclusive i10 Dehumidifier Preview
Press

Meet Inslogic Across the Globe: August–September Exhibitions & Exclusive i10 Dehumidifier Preview

Inslogic is heading to three major additive manufacturing trade shows this August and September! Visit our booths in Brazil, Shenzhen, and Istanbul to explore our high-performance materials, join o...
Inslogic Lab Notes Vol. 4: Precision Bridging & Perfect Woodfill PLA Removal
Filament Guide

Inslogic Lab Notes Vol. 4: Precision Bridging & Perfect Woodfill PLA Removal

Saggy bridges and torn Woodfill PLA bottom layers can turn a great model into scrap. In Inslogic Lab Notes Vol. 4, we isolate two key slicing adjustments and a four-step material care routine to en...